New Features in NI Multisim in 13.0
The latest version of Multisim enhances already powerful simulation technology with the ability to analyze analog, digital, and power design electronics. Added functionality includes all-new parameter analysis, integration with new embedded targets, and simplified design with user-definable templates. Multisim Standard Service Program (SSP) customers also have access to self-paced online training.
Devices from Maxim, Infineon, NXP, ON Semiconductor, and Analog Devices add to the library of the latest SPICE models to evaluate design choices.
Sweep critical component parameters and iterate through parametric information in advanced simulations to optimize design performance.
Automate Multisim simulation with LabVIEW to correlate measurements, acquire real signals, and evaluate performance under iterative conditions.
With the addition of new eGAN MOSFETs from market innovator EPC and a configurable thermal IGBT model, you can simulate applications with greater accuracy.
Create, share, and modify user-configurable templates to set critical spacing and layout settings to aid in prototyping.
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